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Patent Searching and Data


Title:
FILM BONDING APPARATUS
Document Type and Number:
Japanese Patent JP2000177086
Kind Code:
A
Abstract:

To keep a bonded film free from distortion by executing film bonding and adhesive curing with reference to an object with an adhesive applied on the surface, and furnishing an antistatic member to be in close contact with the curing period of an adhesive.

When a film 21 is bonded, at least, a support stage is moved to a position A; then placed and fixed thereon is a glass plate 20 with a UV ray curable type adhesive 22 applied on the surface. Subsequently, the film 21 is supplied on the glass plate 20, and a bonding roller 13 is moved downward to be in contact with the lateral peripheries of the film 21. As such, by permitting the bonding roller 13 to be moved in a horizontal direction, the film 21 is pressed to the glass plate 20. After that, the support stage and movement glass state 12 are moved to a position B so that the close contacting surface of a charge plate 14 is put in close contact with the surface of the film by an air cylinder. By keeping this state, adhesive 22 is irradiated with UV rays emitted from a UV ray lamp 16 in order to cure adhesive 22.


Inventors:
KAKINUMA MASAYASU
Application Number:
JP35346798A
Publication Date:
June 27, 2000
Filing Date:
December 11, 1998
Export Citation:
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Assignee:
SONY CORP
International Classes:
B32B37/00; B29C63/02; B29C65/48; B32B43/00; B29L9/00; (IPC1-7): B32B31/00; B29C63/02; B29C65/48; B32B35/00
Attorney, Agent or Firm:
Oka-saki-Shintaro (1 person outside)