PURPOSE: To eliminate a plating malfunction even if a photoresist surface is damaged to cause a disconnection by adding an auxiliary conductive band in parallel with a conductive band to an inside proximity position of the band.
CONSTITUTION: An auxiliary conductive band 10 is additionally formed in parallel with a conductive band 3 of a film carrier obtained by pattern-molding pads 8, 8' and leads 5, 6 at the band parallel to through hole rows and between both the bands 3 inside sprocket through holes 2, at an inside proximity position of the band 3. In this case, even if a photoresist surface is damaged so that a disconnection 11 due to etching is formed, the pads 8, 8' corresponding to the disconnection 11 can be energized from adjacent plated wirings 9 at both sides through the band 10, and no plating malfunction occurs. Thus, its productivity can be improved.
HATAKEYAMA YASUSHI
KATAOKA WATARU
