成膜装置 - Canon ANELVA Corporation

Title:

成膜装置

Document Type and Number:

Japanese Patent JP4336739

Kind Code:

B2

Abstract:

A sputtering deposit apparatus capable of depositing a thin film having uniform sheet resistance value is provided. The sputtering deposit apparatus is arranged with at least two magnetron sputtering units within a film deposit chamber. On the upstream side in the substrate transfer direction 43 of the target shield 55 provided on the magnetron sputtering unit disposed on the most upstream side in the substrate transfer direction, of at least the two magnetron sputtering units, there is disposed the first cathode shield 62 which is electrically insulated.

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Inventors:

Masao Sasaki

Application Number:

JP2008547798A

Publication Date:

September 30, 2009

Filing Date:

June 04, 2008

Export Citation:

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