Title:
FILM DEPOSITION METHOD AND FILM DEPOSITION APPARATUS
Document Type and Number:
Japanese Patent JP2012201970
Kind Code:
A
Abstract:
To reduce irregularities in film thickness of a dielectric layer, in a film deposition method and a film deposition apparatus for forming the dielectric layer by using the powder injection coating method.
In the film deposition method, a dielectric layer is formed on a surface of a sheet base material 5 by using the powder injection coating method. The method includes a step (a) and a step (b). In the step (a), the surface of the sheet base material 5 is curved in a convex or concave shape. In the step (b), the dielectric layer is formed by depositing dielectric powder on the curved surface of the sheet base material 5, by using the powder injection coating method.
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Inventors:
NAGAMITSU KENICHI
Application Number:
JP2011070464A
Publication Date:
October 22, 2012
Filing Date:
March 28, 2011
Export Citation:
Assignee:
SANYO ELECTRIC CO
International Classes:
C23C24/04; B05B13/02; B05D1/12; H01L21/31; H01L21/316
Attorney, Agent or Firm:
Takaomi Tsujimoto
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