Title:
成膜装置および成膜方法
Document Type and Number:
Japanese Patent JP5231117
Kind Code:
B2
Abstract:
In a coating apparatus, a distributor plate 104 is disposed upstream of a silicon wafer 101 relative to the direction of flow of reactive gas. The distributor plate 104 has therein first through-holes 104a and second through-holes 104b arranged so as not to meet the first through-holes 104a. The reactive gas passes through the first through-holes 104a and flows down toward the silicon wafer 101. Further, a cooling gas passes through the second through-holes 104b.
Inventors:
Moriyama Yoshikazu
Kunihiko Suzuki
Hironobu Hirata
Kunihiko Suzuki
Hironobu Hirata
Application Number:
JP2008191286A
Publication Date:
July 10, 2013
Filing Date:
July 24, 2008
Export Citation:
Assignee:
New Flare Technology Co., Ltd.
International Classes:
H01L21/205; C23C16/455; H01L21/31
Domestic Patent References:
| JP7193003A | ||||
| JP2009141343A | ||||
| JP2009231558A | ||||
| JP5089451U | ||||
| JP2001525997A | ||||
| JP9002896A |
Foreign References:
| WO2008032910A1 | ||||
| US20040216668 |
Attorney, Agent or Firm:
Atsuko Oaku
Previous Patent: JPS5231116
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