Title:
成膜装置、成膜方法、及び有機ＥＬ表示装置の製造方法
Document Type and Number:
Japanese Patent JP6954880
Kind Code:
B2
Abstract:
The present invention provides a film forming apparatus for forming a film on a substrate via a mask, the film forming apparatus including an electrostatic chuck having an electrode portion for applying a voltage for adsorbing the substrate, and a voltage applying portion for applying the voltage to the electrode portion, the voltage applying portion applying the voltage to the electrode portion when the substrate is adsorbed by the electrostatic chuck, and applying the voltage to the electrode portion when the substrate is adsorbed by the electrostatic chuck. The voltage applying portion applies a first voltage to the electrode portion, after the electrostatic chuck sucks the substrate and before deposition of the suctioned substrate by vapor deposition is started, the voltage applying portion applies a second voltage lower than the first voltage to the electrode portion, and after deposition of the suctioned substrate is completed, the voltage applying portion applies a second voltage lower than the second voltage to the electrode portion. The voltage applying portion applies a third voltage for peeling the substrate from the electrostatic chuck to the electrode portion.
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Inventors:
Hiroshi Ishii
Kashiwakura Kazushi
Kashiwakura Kazushi
Application Number:
JP2018200156A
Publication Date:
October 27, 2021
Filing Date:
October 24, 2018
Export Citation:
Assignee:
Canon Tokki Co., Ltd.
International Classes:
C23C14/50; C23C14/04; C23C14/24; H01L21/683; H01L51/50; H05B33/10
Domestic Patent References:
| JP2014065959A | ||||
| JP10270539A | ||||
| JP2016195155A | ||||
| JP2008235900A | ||||
| JP2010141352A |
Attorney, Agent or Firm:
Hidewa Patent Office