Title:
FILM-FORMING APPARATUS AND FILM-FORMING METHOD
Document Type and Number:
Japanese Patent JP2008013848
Kind Code:
A
Abstract:
To provide a film-forming method capable of filling a fine recessed portion with a high step coverage by forming e.g. a CuMn alloy film and a Mn film through a heat-treatment such as CVD process and of drastically reducing the apparatus cost by enabling continuous treatment in one treatment apparatus.
The thin film is formed on a surface of a substrate to be treated through a heat-treatment using a copper-containing gas, a transition metal-containing gas and a reduction gas in a vacuumable treatment container 14. By forming e.g. the CuMn alloy film and the Mn film, by the heat-treatment such as CVD process, the fine recessed portion can be filled with a high step coverage.
Inventors:
MATSUMOTO KENJI
KOIKE JUNICHI
NEISHI KOJI
KOIKE JUNICHI
NEISHI KOJI
Application Number:
JP2007148856A
Publication Date:
January 24, 2008
Filing Date:
June 05, 2007
Export Citation:
Assignee:
TOKYO ELECTRON LTD
UNIV TOHOKU
UNIV TOHOKU
International Classes:
C23C16/18; C23C16/455; C23C16/56; H01L21/28; H01L21/285; H01L21/3205; H01L21/768; H01L23/52
Attorney, Agent or Firm:
Akihiro Asai