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Title:
FILM-FORMING COMPOSITION, INSULATING FILM, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2011026375
Kind Code:
A
Abstract:

To provide a film-forming composition capable of forming an insulating film that is not susceptible to damages even in an etching process and maintains film characteristics, an insulating film formed from such a film-forming composition, and a semiconductor device equipped with such an insulating film.

The film-forming composition includes a polymerizable compound having a polymerizable functional group, wherein the polymerizable compound has, in the molecule, a partial structure including a cage structure of an adamantane type and a polymerizable reactive group that contributes to polymerization reaction. The polymerizable reactive group has an aromatic ring and an ethynyl group or a vinyl group directly bonded to the aromatic ring. In the polymerizable compound, the number of carbon atoms derived from the aromatic ring is 15-38% relative to the number of carbon atoms of the whole polymerizable compound.


Inventors:
NAKAJIMA MICHIO
SAITO HIDENORI
HARADA TAKAHIRO
MATSUTANI MIHOKO
Application Number:
JP2009170557A
Publication Date:
February 10, 2011
Filing Date:
July 21, 2009
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08F138/00; C08F136/00; C08L49/00; H01L21/312; H01L21/768; H01L23/522
Domestic Patent References:
JP2001332543A2001-11-30
JP2005041938A2005-02-17
JP2007317817A2007-12-06
JP2008166752A2008-07-17
JP2008218632A2008-09-18
JP2006245458A2006-09-14
JP2007070597A2007-03-22
JP2009084329A2009-04-23
Attorney, Agent or Firm:
Tatsuya Masuda
Kazuo Asahi



 
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