FILM FORMING METHOD AND FILM FORMING APPARATUS

Title:

FILM FORMING METHOD AND FILM FORMING APPARATUS

Document Type and Number:

Japanese Patent JP2004314074

Kind Code:

A

Abstract:

To provide a film forming method and a film forming apparatus using a droplet material.

A process of forming a droplet material spotting accuracy confirming pattern within an evaluation region in a droplet material spotting accuracy testing region 200 located outside a film forming region, a process of forming a droplet material spotting accuracy testing layer so as to cover at least the droplet material spotting accuracy confirming pattern in the droplet material spotting accuracy testing region, a process of forming a projection-shaped layer by ejecting the droplet material at a position corresponding to the position of the droplet material spotting accuracy confirming pattern on the droplet material spotting accuracy testing layer, and a process of evaluating droplet material spotting accuracy on the basis of a relative position between the droplet material spotting accuracy confirming pattern and the projection-shaped layer, are provided to the film forming apparatus.

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Inventors:

KIGUCHI HIROSHI
KATAUE SATORU
ITO TATSUYA
ARIGA HISASHI

Application Number:

JP2004137778A

Publication Date:

November 11, 2004

Filing Date:

May 06, 2004

Export Citation:

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Assignee:

SEIKO EPSON CORP

International Classes:

G02B5/20; B05C5/00; B05D1/26; B05D3/00; (IPC1-7): B05D1/26; B05C5/00; B05D3/00; G02B5/20

Attorney, Agent or Firm:

Inoue Ichi
Yukio Fuse
Mitsue Obuchi

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