Title:
FILM FORMING METHOD
Document Type and Number:
Japanese Patent JP3293223
Kind Code:
B2
Abstract:
PURPOSE: To form a uniform and smooth film at low cost without deformation by vibrating or stirring the part to be treated having an adhesive layer with a powder of materials of different melting points, containing powder of flat particles having high melting point, and then subjecting the part to heat treatment.
CONSTITUTION: At least a part of the surface of parts to be treated is coated with an adhesive layer. The parts and powders consisting of two or more materials having different melting points are vibrated or stirred in a chamber with a film forming material which is smaller than the parts but larger than the powder particle so that a coating film containing these powders on the surface of the parts. In this process, at least one of powders having higher melting point must be powder of flat particles. Then the formed film is heated at temp. higher than the melting point of one of the powders and lower than the melting point of the powder of flat particles. Thereby, particles are fused and welded to one another, and a uniform and smooth coating film can be formed even on parts of complicated shape or small-size parts.
Inventors:
Masato Sagawa
Hiroshi Nagata
Osamu Itaya
Hiroshi Nagata
Osamu Itaya
Application Number:
JP7524893A
Publication Date:
June 17, 2002
Filing Date:
March 09, 1993
Export Citation:
Assignee:
Intermetallics Co., Ltd.
International Classes:
C23C26/00; (IPC1-7): C23C26/00
Attorney, Agent or Firm:
Hirai Ho (1 person outside)
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