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Patent Searching and Data


Title:
FILM IN-MOLDED BODY
Document Type and Number:
Japanese Patent JPH09109179
Kind Code:
A
Abstract:

To manufacture a film in-molded body of superior durability which maintains a good appearance without generating a release for a long period of time by improving the bonding properties of a film with a base of the film in-molded body.

A synthetic resin film 2 composed of a protective layer 21, a printed layer 22 and a bonding material layer 23 is disposed in a mold, and a synthetic resin material forming a base 1 is injected to integrate the film with the base. As the base 1, ABS resin in which butadiene rubber particles are dispersed in a matrix composed of an acrylonitrile-styrene copolymer or its modified body or its derivative is used, and the molecular-weight distribution (d) of the acrylonitrile-styrene copolymer or its modified body or its derivative forming the matrix is set in the range of 2.18<d<3.05 to improve remarkably the bonding properties of the film 2 with the base 1.


Inventors:
HORIBA YUKIHIKO
TOMITA HISATAKA
IWATA YASUO
YAMASAKI CHIHO
MIYAKE TOMOKO
WATANABE KENICHI
Application Number:
JP22769796A
Publication Date:
April 28, 1997
Filing Date:
August 08, 1996
Export Citation:
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Assignee:
TOYODA GOSEI KK
International Classes:
B32B27/00; B29C45/14; B29C45/16; B29K55/02; (IPC1-7): B29C45/14; B29C45/16; B32B27/00
Attorney, Agent or Firm:
Ito Juma