Title:
フィルム状異方導電性接着剤
Document Type and Number:
Japanese Patent JP5838674
Kind Code:
B2
Abstract:
A film-like anisotropic conductive adhesive, which has connection reliability and repairability, and does not lose adhesive strength even if the heating temperature is reduced during bonding, is provided. Said adhesive contains (A) a phenoxy resin, (B) an epoxy resin, (C) a thermoplastic elastomer, (D) a microcapsule-type imidazole-based latent curing agent, and (E) conductive particles. The (C) thermoplastic elastomer is preferably a polyamide-based thermoplastic elastomer, and the content of the (C) thermoplastic elastomer with respect to the total quantity of resin is preferably 2 to 30 mass%.
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Inventors:
Masamichi Yamamoto
Mikage Katsunari
Naoki Niihara
Mikage Katsunari
Naoki Niihara
Application Number:
JP2011197861A
Publication Date:
January 06, 2016
Filing Date:
September 12, 2011
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
C09J163/00; C09J7/00; C09J11/04; C09J11/06; C09J163/02; C09J171/10; C09J177/00; H01B1/22; H01B5/16; H01B17/16; H01R11/01; H05K3/32
Domestic Patent References:
| JP2004277573A | ||||
| JP2010147042A | ||||
| JP2010261003A | ||||
| JP2010219135A | ||||
| JP2011014717A | ||||
| JP1236260A | ||||
| JP2007091959A | ||||
| JP2002265916A | ||||
| JP9143445A | ||||
| JP7173448A | ||||
| JP2001127395A | ||||
| JP2011171688A | ||||
| JP2004352785A |
Foreign References:
| WO2011062149A1 | ||||
| WO2011077979A1 |
Attorney, Agent or Firm:
Eriko Kamiya