Title:
FILM-LIKE POSITIVE TYPE PHOTOSENSITIVE ADHESIVE COMPOSITION, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2015034986
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a film-like positive type photosensitive adhesive composition that can exhibit adequate flowability in the connection of semiconductor chips with each other or the connection of a semiconductor chip with a supporting member for mounting a semiconductor chip and is excellent in pattern formability, reflow resistance and connectivity.SOLUTION: The film-like positive type photosensitive adhesive composition comprises (A) an alkali-soluble resin and (B) a compound generating an acid by light and is used as an underfill material in a semiconductor device in which a connection part in each of connection of semiconductor chips with each other or connection of a semiconductor chip with a support member for mounting a semiconductor chip is electrically connected. The alkali-soluble resin (A) includes a polyimide resin having a phenolic hydroxyl group or a polyamide resin having a phenolic hydroxyl group.
Inventors:
MINEGISHI TOMONORI
RAI HANAKO
ZEISHO RYOTA
RAI HANAKO
ZEISHO RYOTA
Application Number:
JP2014143280A
Publication Date:
February 19, 2015
Filing Date:
July 11, 2014
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
G03F7/023; C09J7/00; C09J7/02; C09J11/06; C09J163/00; C09J177/00; C09J179/08; G03F7/004
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
古下 Tomoya
Junichiro Sakamaki
Yoshinori Shimizu
古下 Tomoya
Junichiro Sakamaki