Title:
フィルム材料及びパターン形成方法
Document Type and Number:
Japanese Patent JP6620714
Kind Code:
B2
Abstract:
A film material includes a support film having a transmittance of at least 60 % with respect to light of wavelength 300-450 nm, and a resin layer containing 0.001-10 wt% of a basic compound with a molecular weight of up to 10,000, and having a thickness of 1-100 µm. A pattern is formed by attaching the resin layer in the film material to a chemically amplified negative resist layer on a wafer, exposing, baking, and developing the resist layer. The profile of openings in the pattern is improved.
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Inventors:
Satoshi Asai
Kyoko Soga
Hideto Kato
Kyoko Soga
Hideto Kato
Application Number:
JP2016202294A
Publication Date:
December 18, 2019
Filing Date:
October 14, 2016
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
B32B7/023; B32B27/00; C08G77/52; C08K5/16; C08L83/14; G03F7/004; G03F7/038; G03F7/20
Domestic Patent References:
| JP2016071355A | ||||
| JP2014006507A | ||||
| JP2015172759A | ||||
| JP2008003569A | ||||
| JP2014056194A | ||||
| JP2015529853A |
Foreign References:
| US20090258315 |
Attorney, Agent or Firm:
Hideaki International Patent Office