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Patent Searching and Data


Title:
FILM MOLDING DIE
Document Type and Number:
Japanese Patent JPS5916719
Kind Code:
A
Abstract:

PURPOSE: To provide easily a film molding die by inserting plates into a plate retainer ring.

CONSTITUTION: A plate retainer ring 12 is set on a bottom force base 11. A plate retainer ring 13 is set within the plate retainer ring 12 on the base 11. The retainer ring 12 is provided with slits 14..., arranged radially at a suitable angle on the internal circumference, while the retainer ring 13 is provided with slits 15... facing the slits 14... at a suitable angle on the external circumference. There are plates 16 which are located between these two retainer rings 12, 13, respectively insert both ends into facing slits 14, 15 and the upper ends of which are located over the retainer ring 12, 13. Synthetic resin film 29 are put between the plates 16, 26 and folded in zigzag manner. The pitch of a zigzag film molded product can be changed by a suitable change of the inserting positions of the plates 16, 26 and the shape of the film molded product can be changed by changing the shapes of the plates 16, 26.


Inventors:
INADA YOSHIJI
HIRATA SUSUMU
KOUNO TOMOMUNE
Application Number:
JP12649582A
Publication Date:
January 27, 1984
Filing Date:
July 19, 1982
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B29C53/00; B29C33/00; B29C45/00; B29C51/30; B29C53/04; B29D7/00; B29L31/38; (IPC1-7): B29D7/00
Domestic Patent References:
JPS568233A1981-01-28
JPS52168966U1977-12-21
JPS4739162A
Attorney, Agent or Firm:
Yoshihiro Morimoto