Title:
FILM PASTING AND CUTTING DEVICE, FILM SEPARATION DEVICE, AND LAMINATE SYSTEM
Document Type and Number:
Japanese Patent JP2023046008
Kind Code:
A
Abstract:
To provide a film pasting and cutting device capable of simply and economically improving non-defective product rate of a laminated product.SOLUTION: A film pasting and cutting device 1 comprises: a pasting unit 10U having a pasting member for pasting a film F delivered from a film supply roll, onto a workpiece W, and a cutter for cutting the film F at a position that does not overlap the workpiece W; a first pasting side cooling part 21 disposed on the same side as a side in which the pasting unit 10U is located with respect to the workpiece W and the film F on the workpiece W; a second pasting side cooling part 22 disposed on the opposite side to the side in which the pasting unit 10U is located with respect to the workpiece W and the film F on the workpiece W; and a cooling media supply part 23 for forwarding an air supplied by the first pasting side cooling part 21 and an air supplied by the second pasting side cooling part 22 from a branched air channel 24A and 24B to the first pasting side cooling part 21 and the second pasting side cooling part 22.SELECTED DRAWING: Figure 1
Inventors:
TAKAYAMA MICHIO
MORIMUNE AYUMI
MORIMUNE AYUMI
Application Number:
JP2021154671A
Publication Date:
April 03, 2023
Filing Date:
September 22, 2021
Export Citation:
Assignee:
SHINWA CONTROLS CO LTD
International Classes:
B29C63/02; B65H37/04; B65H41/00
Attorney, Agent or Firm:
Nakamura Yukitaka
Miyajima Manabu
Yukihiro Hotta
Yoshiki Kanagawa
Miyajima Manabu
Yukihiro Hotta
Yoshiki Kanagawa