Title:
フィルム貼付方法、裏面研削方法、半導体チップ作製方法及びフィルム貼付装置
Document Type and Number:
Japanese Patent JP5882577
Kind Code:
B2
Inventors:
Ichita Saito
Shinya Nakajima
Shinya Nakajima
Application Number:
JP2010271893A
Publication Date:
March 09, 2016
Filing Date:
December 06, 2010
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
H01L21/683; H01L21/304
Domestic Patent References:
| JP2009231699A | ||||
| JP2005317711A | ||||
| JP2010258136A | ||||
| JP11053778A |
Attorney, Agent or Firm:
Atsushi Aoki
Jun Tsuruta
Tetsuro Shimada
Hirose Shigeki
Ryuichi Nishimura
Kazuo Maejima
Jun Tsuruta
Tetsuro Shimada
Hirose Shigeki
Ryuichi Nishimura
Kazuo Maejima