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Title:
FILM PATTERN FORMING METHOD, DEVICE AND ITS MANUFACTURING METHOD, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2005012173
Kind Code:
A
Abstract:

To provide a film pattern forming method by which a narrow film pattern can be formed precisely and stably.

The method has a process of forming a bank B on a substrate P and a process of shooting liquid drops of functional liquid L on the substrate P and locating the functional liquid L to a region A divided by the bank B. An impact interval h of the liquid drops shot is an interval in which the liquid drops are connected in the region A after the impact. At the impact position of the liquid drops in the edge of the region A, a distance Le from the edge of the region A is not longer than one half of the impact interval h of the liquid drops.


Inventors:
MIKOSHIBA TOSHIAKI
Application Number:
JP2004095975A
Publication Date:
January 13, 2005
Filing Date:
March 29, 2004
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
G02F1/1368; B05D1/26; B05D5/12; B05D7/00; B41J2/14; C23C4/12; C23C26/02; G02F1/1345; G09F9/00; H01L21/28; H01L21/288; H01L21/3205; H01L21/336; H01L21/768; H01L29/786; H01L51/50; H05B33/10; H05K3/12; H01L51/00; H01L51/40; (IPC1-7): H01L21/288; B05D1/26; B05D5/12; B05D7/00; G02F1/1368; G09F9/00; H01L21/28; H01L21/3205; H01L21/336; H01L29/786; H05B33/10; H05B33/14
Attorney, Agent or Firm:
Kazuya Nishi
Masatake Shiga
Masakazu Aoyama



 
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