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Title:
FILM THICKNESS MEASURING METHOD, FILM THICKNESS DISTRIBUTION MEASURING METHOD, AND FILM THICKNESS MEASURING DEVICE
Document Type and Number:
Japanese Patent JP3858265
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a film thickness measuring method capable of accurately measuring the thickness of a film covering a curved surface touchlessly, a film thickness distribution measuring method capable of measuring the distribution of film thicknesses, and a film thickness distributing device using these methods.
SOLUTION: The shape of the curved surface 10a of an object to be measured 10 before being covered with the film is measured, and on the basis of the obtained data about the shape, the direction of the normal to the measuring point on the curved surface 10a is made identical to the optical axis of the beams from a light source 7, and thereby it is possible to measure accurately the thickness of the film covering the curved surface 10a.


Inventors:
Osamu Masuda
Kazuzo Furuta
Masahiro Morikawa
Koji Horii
Akiko Kuji
Application Number:
JP2002008162A
Publication Date:
December 13, 2006
Filing Date:
January 17, 2002
Export Citation:
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Assignee:
Konica Minolta Holdings Co., Ltd.
International Classes:
G01B11/06; (IPC1-7): G01B11/06
Domestic Patent References:
JP9106218A
JP2001165627A
JP3225206A
Attorney, Agent or Firm:
Keijiro Tamura
Kenichi Kobayashi