Title:
フィルム搬送装置及びフィルム搬送方法並びに樹脂モールド装置
Document Type and Number:
Japanese Patent JP6456254
Kind Code:
B2
Abstract:
Provided are a film transfer device, a film transport method, and a resin molding device. The film transfer device can convey a single film by being followed to a cavity concave part without generating wrinkles after transferring the single film by applying appropriate tensile force. A supporting point frame body (13) and the single film (F) is transferred to a mold while applying predetermined tension to the single film (F) by being offset with respect to the supporting point frame body (13b) while scraping an outer peripheral part of the single film (F) by a film chuck (13c).
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Inventors:
Masahiko Fujisawa
Masaki Kawaguchi
Masaki Kawaguchi
Application Number:
JP2015121381A
Publication Date:
January 23, 2019
Filing Date:
June 16, 2015
Export Citation:
Assignee:
Apic Yamada Corporation
International Classes:
B29C31/04; B29C33/68; B29C43/36; B29C51/26
Domestic Patent References:
| JP60230808A | ||||
| JP38010039B1 | ||||
| JP5016219A | ||||
| JP11077815A | ||||
| JP60130019U | ||||
| JP61012719U |
Attorney, Agent or Firm:
Watanuki International Patent and Trademark Office