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Patent Searching and Data


Title:
FILMY ADHESIVE FOR METAL AND ADHESIVE COMPOSITION FOR METAL
Document Type and Number:
Japanese Patent JPH08109354
Kind Code:
A
Abstract:

PURPOSE: To obtain a filmy adhesive excellent in stability with time, adhesion to metals and resistance to solvents having strong electron donative properties by using a specific polyamide resin, an epoxy resin and a novolak type phenol resin together as adhesive components.

CONSTITUTION: This adhesive is obtained by dissolving (A) an alkali-soluble polyamide resin (preferably a nylon 12-based alcohol-soluble type polyamide resin having ≤-10°C Tg), (B) an epoxy resin and (C) a novolak type phenol resin in an organic solvent (preferably an alcoholic organic solvent) and drying the resultant solution into a filmy state or impregnating nonwoven fabric with the solution and drying the nonwoven fabric impregnated therewith. Furthermore, the respective components are preferably used in amounts so as to provide 40-90wt.% component (A), 5-30wt.% component (B) and 5-40wt.% component (C) based on 100 wt.% total amount of the components (A) to (C). A sulfonium salt-based latent curing agent in an amount of ≤5wt.% based on 100 wt.% total amount of the components (A) to (C) is preferably blended as an epoxy resin curing agent.


Inventors:
HASUNUMA KENZO
HASHIMOTO SHINICHI
TAKAHASHI KAZUHIKO
Application Number:
JP24638794A
Publication Date:
April 30, 1996
Filing Date:
October 12, 1994
Export Citation:
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Assignee:
PANATSUKU KK
International Classes:
C09J7/00; C09J7/04; C09J161/06; C09J163/00; C09J177/00; (IPC1-7): C09J7/00; C09J7/04; C09J161/06; C09J163/00; C09J177/00
Attorney, Agent or Firm:
Minoru Nakamura (7 outside)