Title:
FILMY BONDING MEMBER
Document Type and Number:
Japanese Patent JP2001311053
Kind Code:
A
Abstract:
To provide a filmy bonding member excellent in soldering heat resistance, heat resistance and adhesion, in particular capable of bonding at low temperature of ≤250°C.
This filmy bonding member is such as to be provided with an adhesive layer consisting of a composition essentially comprising (A) 100 pts.wt. of a soluble polyimide and (B) 1-150 pts.wt. of a compound having at least two unsaturated double bonds; wherein it is characterized that, preferably, the Tg of the composition is -20 to 150°C in its B-stage condition, the Tg after cured 70-300°C, the Tg of the component A is 100-300°C, and the thermal expansion coefficient after cured is 20-500 ppm.
Inventors:
OKADA YOSHIFUMI
HARA MASAYUKI
NOJIRI HITOSHI
HARA MASAYUKI
NOJIRI HITOSHI
Application Number:
JP2000130553A
Publication Date:
November 09, 2001
Filing Date:
April 28, 2000
Export Citation:
Assignee:
KANEGAFUCHI CHEMICAL IND
International Classes:
C09J7/00; C09J4/00; C09J163/00; C09J179/08; (IPC1-7): C09J4/00; C09J163/00; C09J179/08
Domestic Patent References:
| JPH06200216A | 1994-07-19 | |||
| JPH05155984A | 1993-06-22 | |||
| JPH04255750A | 1992-09-10 | |||
| JP2000063788A | 2000-02-29 | |||
| JPH11261240A | 1999-09-24 | |||
| JPH07197007A | 1995-08-01 | |||
| JP2001311055A | 2001-11-09 |