Title:
FIN STACK DEVICE AND FIN STACK METHOD
Document Type and Number:
Japanese Patent JP2017213591
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To improve reliability of transportation and lamination of fins, in a fin stack device for transporting, cutting and laminating a metal strip having fins molded thereon.SOLUTION: A fin stack device includes a transportation surface 104 on which a metal strip 101 having fins molded thereon is placed, a guide part 105 provided above the transportation surface and having a U-shaped cross section, for regulating a width direction and an upper surface of the metal strip 101, and an open hole 111 provided on the upper surface of the guide part 105, for sending compressed air 118 to be sprayed onto fins 1 of the metal strip 101, and transports the metal strip 101 along the transportation surface 104 by compressed air 118 from the open hole 111.SELECTED DRAWING: Figure 5
Inventors:
OGURA TAKUYA
TOMINAGA KOSUKE
TOMINAGA KOSUKE
Application Number:
JP2016110698A
Publication Date:
December 07, 2017
Filing Date:
June 02, 2016
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B21D43/22; B21D43/28; B21D53/08
Attorney, Agent or Firm:
Masuo Oiwa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa