FINE BALL BUMP FORMING METHOD AND DEVICE

Title:

FINE BALL BUMP FORMING METHOD AND DEVICE

Document Type and Number:

Japanese Patent JPH1074767

Kind Code:

A

Abstract:

To enable fine ball bumps to be quickly and surely formed.

Fine vibrations are applied to a case 6 where fine balls 5 are housed to make fine balls 5 start jumping, one of the jumping fine balls 5 is attracted by vacuum suction to a ball arranging board 1 where a ball suction hole is bored, fine balls 5a other than the fine ball 5 attracted to the ball suction hole 3 by vacuum suction are removed by vibrations of smaller amplitude, and then the ball arranging board 1 is moved over a ball bump forming target board 10 and aligned. Then, the fine ball 5 attracted to the ball suction hole 3 of the ball arranging board l is transferred onto the target board 10 at a bump forming position for the formation of a ball bump, thereby a fine ball bump of high bonding reliability can be easily formed through a simple device.

Inventors:

SHIMOKAWA KENJI
TATSUMI KOHEI
HASHINO HIDEJI

Application Number:

JP24709096A

Publication Date:

March 17, 1998

Filing Date:

August 29, 1996

Export Citation:

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Assignee:

NIPPON STEEL CORP

International Classes:

H01L21/60; H01L21/321; H01L21/603; H01L21/607; (IPC1-7): H01L21/321; H01L21/60; H01L21/603; H01L21/607

Attorney, Agent or Firm:

Kokubun Takaetsu

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