Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FINE STRUCTURE MOLD AND ITS COATING METHOD
Document Type and Number:
Japanese Patent JP2005193668
Kind Code:
A
Abstract:

To provide a fine structure mold and its coating method which have a smooth mold-release characteristic ability of moldings and which raise corrosion resistance by forming a self assembly monomolecular film consisting of a surface active agent in the front face without impeding the accuracy of the mold.

The coating method of the fine structure mold comprises the 1st phase where the face of the fine structure mold is dipped in the mixed solution of a surfactant and an organic solvent, the 2nd step of making the surfactant react with the front face of the fine structure mold to coat the front face of the fine structure mold with the single layer film 13 which consists of the surfactant, the 3rd step of removing the surfactant which does not react with the front face of the fine structure mold from the front face of the fine structure mold, and the 4th step of drying the fine structure mold with the single layer film 13.


Inventors:
YEE YOUNG-JOO
CHANG-HOO OH
KWON HYOUK
Application Number:
JP2004377583A
Publication Date:
July 21, 2005
Filing Date:
December 27, 2004
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
LG ELECTRONICS INC
International Classes:
B05D3/10; B05D7/14; B29C33/58; B29C33/60; B29C45/37; B29D11/00; C23C22/02; G02B3/00; (IPC1-7): B29C33/58; B05D3/10; B05D7/14
Attorney, Agent or Firm:
Calyx
Miyazaki Yoshio
Mitsuo Tateishi
Kaoru Onozuka
High Masahiro
Toshio Nakamura
Tsutomu Kato
Yusuke Murakoshi
Tomoaki Komiya