Title:
FINGER JOINT FOR BUTTING BOARD
Document Type and Number:
Japanese Patent JP3469002
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a finger joint for a butting board with stable jointing strength and no stress concentration by making the stepped part of a wall minimal and a jointed part less conspicuous and causing an adhesive resin to permeate the jointed part without the quantitative excess or shortage of the resin, in the finger joint for abutting board veneer.
SOLUTION: A feed roller 4 for a following butting board 3b, a vibratory butting mechanism 5 for butting a finger cut part while vibrating the butting board 3b, a glass plate 6 for holding the butting board 3 at the time of butting so that the board 3 does not jump up, a preceding butting board pressing mechanism 7 for holding a preceding butting board 3a and an adhesive tape supply mechanism 8 for attaching an adhesive tape onto the butted finger cut parts of the preceding/following butting boards 3a, 3b are arranged in that order according to a fabrication step for a finger joint. In addition, a press 10 for pressurizing and heating the top of the butted finger cut parts in such a state that the glass plate 6 is rejected up and stored in place.
Inventors:
Kanji Kitayama
Application Number:
JP22690796A
Publication Date:
November 25, 2003
Filing Date:
August 28, 1996
Export Citation:
Assignee:
Nakanishi Co., Ltd.
International Classes:
B27D1/10; (IPC1-7): B27D1/10
Domestic Patent References:
| JP393502A | ||||
| JP5329803A |
Attorney, Agent or Firm:
Bunji Kamata (2 outside)