To provide a finishing method for an integrated circuit of high manufacture yield, small number of maintenance processes, lower cost of tool and spare parts, etc., high manufacture precision, less labor in inspection and check of an integrated circuit after manufacture, and low manufacturing cost.

Burring of resin, removing of tie bars and pinches, and cutting of leads are performed with a plurality of integrated circuits 1 formed on a lead frame 2, and the integrated circuits 1 are separated each other. Here, with a laser protective mask 3, which allows transmission of laser beam only at the work part of the lead frame 2 provided, laser working/cutting is performed on the work part of the lead frame 2 through the laser protective mask 3.