Title:
FITTING METHOD OF THIN FILM SENSOR
Document Type and Number:
Japanese Patent JP3239505
Kind Code:
B2
Abstract:
PURPOSE: To provide a fitting method of a thin film sensor having good heat resistance.
CONSTITUTION: In a fitting method of a thin film sensor 9 for measuring the temperature of a machine part, a heat resisting metallic layer 2 is formed on the surface of the part 1, silicon nitride layers 3, 5 and alumina layers 4, 6, or silicon nitride layers 10, 12 and a boron nitride layer 11, are alternately laminated so as to form insulating thin films 8, 13, and a thin film sensor 9 is fitted on the insulating thin film.
Inventors:
Joji Shinohara
Eri Nagata
Toshikazu Kunikyo
Eri Nagata
Toshikazu Kunikyo
Application Number:
JP412093A
Publication Date:
December 17, 2001
Filing Date:
January 13, 1993
Export Citation:
Assignee:
Ishikawajima Harima Heavy Industries Co., Ltd.
International Classes:
G01D21/00; (IPC1-7): G01D21/00
Domestic Patent References:
| JP4318420A | ||||
| JP4103167A | ||||
| JP54102146A | ||||
| JP3251755A |
Attorney, Agent or Firm:
Nobuo Kinutani