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Title:
FIXED STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2014022679
Kind Code:
A
Abstract:

To provide a fixed structure which is formed by fixing a flexible printed wiring board on an object to be connected such as a housing, and in which the flexible printed wiring board can be firmly fixed on the object to be connected by effectively preventing the flexible printed wiring board from coming off from a fitting protrusion of the object to be connected, and provide a method of manufacturing the same.

In a fixed structure 1 formed by fixing a flexible printed wiring board 20 on a housing 10, the housing 10 includes a fitting protrusion 11 having a coming-off prevention piece 11b on a tip thereof, the flexible printed wiring board 20 includes a through hole T in which notched parts are provided on an outer periphery thereof as fitting recesses, and the through hole T is fitted to the fitting protrusion 11 in which a diameter F of the coming-off prevention piece 11b is larger than a diameter G of the through hole T.


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Inventors:
YOSHITOMI SHINYA
HATANAKA TOMONOBU
Application Number:
JP2012162434A
Publication Date:
February 03, 2014
Filing Date:
July 23, 2012
Export Citation:
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Assignee:
SUMITOMO ELEC PRINTED CIRCUITS
International Classes:
H05K7/14; H05K1/02
Domestic Patent References:
JPH01104065U1989-07-13
JPH05243761A1993-09-21
JP2010027404A2010-02-04
JP2006019324A2006-01-19
Attorney, Agent or Firm:
Patent Corporation Heart Cluster
Rikio Murota