Title:
固定構造
Document Type and Number:
Japanese Patent JP6420743
Kind Code:
B2
Abstract:
Provided is a fixing structure in which a gap is maintained between a through-hole wall surface and a protrusion. In order to fix a metal plate 10 to a resin plate 20 by heat staking, a through-hole 11 having a larger diameter than that of a heat staking protrusion 21 formed on the resin plate 20 is formed in the metal plate 10. Then, a sheet material 30 having a low thermal conductivity is laid on the metal plate 10. The sheet material 30 has a small-diameter through-hole 31 just large enough to allow the heat staking protrusion 21 to pass through. Then, with the sheet material 30 laid on the metal plate 10, the heat staking protrusion 21 is heated and melted to fix the metal plate 10 to the resin plate 20 by heat staking.
Inventors:
Shunji Aisaka
Application Number:
JP2015215422A
Publication Date:
November 07, 2018
Filing Date:
November 02, 2015
Export Citation:
Assignee:
Tyco Electronics Corporation
International Classes:
B29C65/56; B32B7/08
Domestic Patent References:
| JP2011254001A | ||||
| JP200311232A | ||||
| JP9109268A | ||||
| JP463227U |
Attorney, Agent or Firm:
Masaki Yamada
Mikami Yui
Mikami Yui