FIXING MEMBER FOR CUTTING ELECTRONIC COMPONENT PRIME FIELD AND CUTTING METHOD OF ELECTRONIC COMPONENT PRIME FIELD

Title:

FIXING MEMBER FOR CUTTING ELECTRONIC COMPONENT PRIME FIELD AND CUTTING METHOD OF ELECTRONIC COMPONENT PRIME FIELD

Document Type and Number:

Japanese Patent JP2022047610

Kind Code:

A

Abstract:

To suppress the occurrence of cracks when an electronic component element body is cut with a cutting blade.SOLUTION: A fixing member 10 of an electronic component element body includes a base material 1, and a restraining material layer 2 arranged on a first main surface 1a of the base material 1 and fixing the electronic component element body 20 placed on the first main surface 1a. The Young's modulus of the restraining material layer 2 in the direction parallel to the first main surface 1a of the base material 1 is 0.12 GPa or more and 10 GPa or less.SELECTED DRAWING: Figure 6

More Like This:

JP3463689	[Title of the Invention] A method for manufacturing a laminated electronic component.
JP2013082564	ABLATION PROCESSING METHOD OF CERAMIC SUBSTRATE
JPH0779069	[Title of the Invention] A method for laminating ceramic green sheets and an apparatus therefor.

Inventors:

KIMURA YUTA

Application Number:

JP2020153487A

Publication Date:

March 25, 2022

Filing Date:

September 14, 2020

Export Citation:

Click for automatic bibliography generation Help

Assignee:

MURATA MANUFACTURING CO

International Classes:

H01G13/00; H01G4/30

Domestic Patent References:

JP2002121505A	2002-04-26
JPH09129501A	1997-05-16

Attorney, Agent or Firm:

Takahiro Nosue
Nishizawa Hitoshi

Previous Patent: Ultrasonic diagnostic equipment, measurement condition setting method and program

Next Patent: An image display device including a polarizing plate, a polarizing plate with a retardation layer, a...