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Patent Searching and Data


Title:
FIXING STRUCTURE, SUBSTRATE CONVEYANCE DEVICE, SUBSTRATE PROCESSING DEVICE, AND HEIGHT ADJUSTMENT METHOD OF FIXING STRUCTURE
Document Type and Number:
Japanese Patent JP2017204584
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide fixing structure, a substrate conveyance device, a substrate processing device, and a height adjustment method of the fixing structure that can fine-tune attachment height of an attachment member to a base member without separately preparing an adjustment member such as a shim.SOLUTION: Fixing structure 80 according to one embodiment includes: a base member 61; an attachment member 71 attached to the base member 61; a height adjustment mechanism 90 for adjusting attachment height of the attachment member 71 to the base member 61; and a fixing mechanism 100 for fixing the attachment member 71 whose height is adjusted by the height adjustment mechanism 90 to the base member 61. The height adjustment mechanism 90 includes a plurality of screw adjustment units 91 provided in a freely height adjustable manner to the attachment member 71.SELECTED DRAWING: Figure 3

Inventors:
KUROKI YUSUKE
Application Number:
JP2016096154A
Publication Date:
November 16, 2017
Filing Date:
May 12, 2016
Export Citation:
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Assignee:
EBARA CORP
International Classes:
H01L21/677; H01L21/304
Attorney, Agent or Firm:
Sumio Tanai
Yasushi Matsunuma
Yuichiro Shimizu
Hisanori Takahashi
Saito Takanobu