To provide a fixture for wafer bonding that has excellent wafer bonding yield even if size of wafer is large, and to provide a light-emitting device fabricated by using the same.
The fixture 1 for wafer bonding includes: an upper plate 3 with which an overlapped wafer 2 is covered from upper surface thereof, an lower plate 4 with which the overlapped wafer 2 is covered from the lower surface thereof, and fasteners 5 that fasten the upper plate 3 and lower plate 4 on the peripheries of both plates 3 and 4. The fixture 1 for this wafer bonding keeps the overlapped wafer 2 pressed from the top and bottom by both plates 3 and 4. At least one pressure dispersing plate 6 is provided between the upper plate 3 and the lower plate 4.
COPYRIGHT: (C)2008,JPO&INPIT
AKIMOTO KATSUYA
UNNO TSUNEHIRO
KONNO TAIICHIRO
IIZUKA KAZUYUKI
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