Title:
FLAME-RETARDANT EPOXY RESIN COMPOSITION AND SEMICONDUCTOR-SEALING MATERIAL USING THE SAME
Document Type and Number:
Japanese Patent JP2002128995
Kind Code:
A
Abstract:
To provide a flame-retardant epoxy resin composition having excellent flame-retardant properties without using a halogen compound or a phosphorus- based flame retardant; and a semiconductor-sealing material using the same.
This composition contains (A) a nonhalogenated epoxy resin having at least two epoxy groups, (B) a curing agent, (C) and a carbonate as essential ingredients. The semiconductor-sealing material basically comprises the composition and a filler.
Inventors:
NONAKA HIROTAKA
HIROSE HIROSHI
ORIHARA TAMOTSU
HIROSE HIROSHI
ORIHARA TAMOTSU
Application Number:
JP2000332571A
Publication Date:
May 09, 2002
Filing Date:
October 31, 2000
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C09K3/10; C08G59/62; C08K3/26; C08L63/00; C09K21/02; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08G59/62; C08K3/26; C09K3/10; C09K21/02; H01L23/29; H01L23/31
Domestic Patent References:
| JP2001192535A | 2001-07-17 | |||
| JP2000248156A | 2000-09-12 | |||
| JPH03190965A | 1991-08-20 | |||
| JPS4934935A | 1974-03-30 | |||
| JPS5333298A | 1978-03-29 | |||
| JPH06116363A | 1994-04-26 | |||
| JPH11209569A | 1999-08-03 | |||
| JP2000159981A | 2000-06-13 | |||
| JPH10279813A | 1998-10-20 | |||
| JPH09100337A | 1997-04-15 |
Foreign References:
| WO1999005219A1 | 1999-02-04 |
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