Title:
FLAME-RETARDANT RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH10298269
Kind Code:
A
Abstract:
To provide a thermosetting resin compsn. which does not contain a halogen compd., is excellent in flame retardance and soldering heat resistance, can retain its characteristics for a long term, and is useful as a nonhalogen material required hereafter.
This compsn. essentially comprises 100 pts.wt. phenol novolak epoxy resin or cresol novolak epoxy resin (A), 5-50 pts.wt. maleimide compd. (B) having at least one maleimide group in the molecule, 2-20 pts.wt. arom. amine (C) having an electron attractive group in the molecule, and a phosphorus component (D) in an amt. of 0.5-5 wt.% of the sum of ingredients A, B, and C and contains nitrogen components in an amt. of 2.0-10.0 wt.% of the compsn.
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Inventors:
TOBISAWA AKIHIKO
SUWABE HIROSHI
SUWABE HIROSHI
Application Number:
JP10790797A
Publication Date:
November 10, 1998
Filing Date:
April 24, 1997
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08J5/24; B32B27/38; B32B27/42; C08G59/50; H05K1/03; (IPC1-7): C08G59/50; B32B27/38; B32B27/42; C08J5/24
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