Title:
FLAME-RETARDED RESIN COMPOSITION AND SEMICONDUCTOR- SEALING MATERIAL AND LAMINATED BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2000186186
Kind Code:
A
Abstract:
To provide a flame-retarded resin composition that has a high degree of flame retardancy and excellent reliability with no addition of halogen compound.
This resin composition comprises (A) an epoxy resin that has at least two epoxy groups in one molecular, (B) a curing agent, and (C) an organophosphorus compound that has a chemical structure that at least one phosphorus atom covalently bonds to at least one carbon atom in one molecule and bears at least two hydroxy groups in one molecule. In this resin composition, the content of phosphorus in the resin composition is 0.3-5 wt.%.
Inventors:
ITO MIKIO
HIROSE HIROSHI
HIROSE HIROSHI
Application Number:
JP36498898A
Publication Date:
July 04, 2000
Filing Date:
December 22, 1998
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
B32B27/18; B32B27/38; C08G59/62; C08K5/5397; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; B32B27/18; B32B27/38; C08G59/62; C08K5/5397; H01L23/29; H01L23/31
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