Title:
高周波加熱システム用平面インダクタ
Document Type and Number:
Japanese Patent JP6835437
Kind Code:
B2
Abstract:
A solid-state heating apparatus may be incorporated into stand-alone appliances or other systems. The heating apparatus may include an impedance matching network coupled between an electrode and a radio-frequency (RF) source. The impedance matching network may be a variable impedance matching network that can be adjusted during the heating operation. The impedance matching network may include planar inductors formed from patterned conductive layers disposed either side of a substrate.
Inventors:
Chi Hoa
Chang Yang Wan
Chang Yang Wan
Application Number:
JP2018203642A
Publication Date:
February 24, 2021
Filing Date:
October 30, 2018
Export Citation:
Assignee:
NXP USA,Inc.
International Classes:
H05B6/80; H05B6/70; H05B6/72
Foreign References:
| WO2000051450A1 | ||||
| WO2014050482A1 | ||||
| US20020047009 |
Attorney, Agent or Firm:
Atsushi Honda