FLATNESS MEASURING DEVICE FOR ELECTROLYTIC PLATE

Japanese Patent JP2561019

B2

PURPOSE: To provide a measuring device which continuously and automatically measures the deformation and warp of a sheped-up plate to which an electrolytic plate is installed before it is put into an electrolytic both.
CONSTITUTION: The device is provided with a means which lifts up each shaped-up plate 1 mounted on a cross bar 2 one by one to a specified measuring position by a suspension means provided with a suspension mechanism, and straightens it back and forth in such a way as to be at a position of a measuring surface, and with a means which allows the aforesaid plate to be freely suspended in the vertical direction while the lower surface of the cross bar 2 is made a fulcrum in such a way that the plate 1 is prevented from being deformed due to its own weight and external force. The device is also formed out of an operation processing means 23 which continuously scans the flatness by means of a mechanism where sensors 11a and 11b are moved over the surfaces in the horizontal and vertical directions for measuring in a non- contacting manner each parting distance between the plate 1 and each plane which is faced to both sides of the plate 1 while being in parallel with each other, and transforms obtained data by A/D conversion for analyzing the data.

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KATO MASANOBU
OONISHI MITSUHARU
KOBAYASHI HIDEAKI

JP34823293A

December 04, 1996

December 24, 1993

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SUMITOMO METAL MINING CO

G01B11/30; C25C7/00; G01B5/28; G01B21/30; (IPC1-7): G01B11/30; C25C7/00; G01B21/30

JP7174543A
JP7128038A
JP6288762A
JP6433607U

Yoshihisa Oshida

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