Title:
FLATTENING AGENT FOR ORGANIC FILM FORMATION, COMPOSITION FOR ORGANIC FILM FORMATION, ORGANIC FILM FORMATION METHOD, AND PATTERN FORMATION METHOD
Document Type and Number:
Japanese Patent JP2023124171
Kind Code:
A
Abstract:
To provide a flattening agent for organic film formation from which a composition for organic film formation having high flattening characteristics is given, a composition for organic film formation containing the flattening agent, an organic film formation method using the composition, and a pattern formation method.SOLUTION: A flattening agent for organic film formation is composed of an aromatic-containing compound having a molecular weight represented by the molecular formula of 200-500, wherein the flattering agent for organic film formation is blended with a composition containing a resin for organic film formation and a solvent having complex viscosity of 1.0 Pa s or more in a temperature range of 175°C or higher, and thereby the complex viscosity of the composition becomes less than 1.0 Pa s in the temperature range of 175°C or higher.SELECTED DRAWING: Figure 2
Inventors:
YAMAMOTO YASUYUKI
ISHIWATA KENTA
YANO TOSHIHARU
OGIWARA TSUTOMU
ISHIWATA KENTA
YANO TOSHIHARU
OGIWARA TSUTOMU
Application Number:
JP2022027779A
Publication Date:
September 06, 2023
Filing Date:
February 25, 2022
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
G03F7/11; C08K5/06; C08K5/101; C08L101/00; G03F7/039; G03F7/20
Attorney, Agent or Firm:
Mikio Yoshimiya
Toshihiro Kobayashi
Toru Otsuka
Toshihiro Kobayashi
Toru Otsuka
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