Title:
FLEXIBLE BOARD
Document Type and Number:
Japanese Patent JPH0637415
Kind Code:
A
Abstract:
PURPOSE: To reduce the warpage and the change of size of a flexible board when an electronic part is joined through heating.
CONSTITUTION: In a flexible board, which is composed of a resin member 22 and a metallic member 23 in order to thermally join a part and in which grooves 19 for patterns are formed to the resin member 22, grooves 30 for diminishing thermal shrinkage are further formed to the resin member 22.
Inventors:
MATSUTANI MASAAKI
Application Number:
JP21451792A
Publication Date:
February 10, 1994
Filing Date:
July 20, 1992
Export Citation:
Assignee:
SONY CORP
International Classes:
H05K1/05; (IPC1-7): H05K1/05
Attorney, Agent or Firm:
Oka-saki-Shintaro (1 person outside)
Next Patent: PRINTED WIRING BOARD