FLEXIBLE CIRCUIT BOARD WITH ANISOTROPIC CONDUCTIVE ADHESIVE AND ITS MANUFACTURE

Japanese Patent JP3463539

B2

PROBLEM TO BE SOLVED: To provide flexible circuit board with anisotropic conductive adhesive from which release paper stuck to anisotropic conductive adhesive layers formed in a connecting terminal section can be peeled off easily and a method for manufacturing the circuit board.
SOLUTION: A flexible circuit board constituted by forming a circuit pattern having a connecting terminal section 5 on the surface of a substrate 3 composed of a flexible insulating film is formed in a work sheet 2 in such a state that the board 1 is divided from the sheet 2 by means of notched sections 13, 14, 15, 16, and 17 through micro-joint sections 18 and 19 and anisotropic conductive adhesive layers 7 and 7a are formed on the terminal section 5 of the board 1 and on the work sheet 2 in the extended part of the section 5. Then two pieces of released paper 8 and 8a are respectively stuck to the layers 7 and 7a in such a state that the paper 8 and 8a can be cut by means of the notched section 14 at a position on the work sheet 2 extended from the terminal section 5 beyond the notched section 13.

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Hiroyuki Hishinuma
Kazuaki Suzuki
Yoshiyuki Ohashi

JP29017297A

November 05, 2003

October 22, 1997

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Sony Chemical Co., Ltd.

H05K1/02; H05K1/11; H05K3/00; H05K3/36; H05K3/40; H05K3/32; (IPC1-7): H05K1/02; H05K1/11; H05K3/00; H05K3/40

JP388367U
JP1135766U
JP61196573U

Sei Yanagihara

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