Title:
FLEXIBLE CIRCUIT BOARD AND CHIP PACKAGE INCLUDING THE SAME
Document Type and Number:
Japanese Patent JP2023139254
Kind Code:
A
Abstract:
To provide a flexible circuit board for an all-in-one COF to which a plurality of chips are mounted onto one substrate, a chip package including the same, and an electron device including the same.SOLUTION: A flexible circuit board 100 according to an embodiment of the present invention, includes: a substrate 110; a first wiring pattern layer 121 arranged onto a first surface of the substrate 110; a second wiring pattern layer 122 that is arranged onto a second surface opposite to the first surface of the substrate 110; a first dummy pattern part DP1 that is arranged onto the second surface of the substrate 110 where the second wiring pattern layer 122 is not arranged; and a protection layer 140 that is formed by a first protection layer arranged onto the first wiring pattern layer 121 and a second protection layer arranged onto the second wiring pattern layer 122 and the first dummy pattern part DP1. At least a part of the first dummy pattern part DP1 is overlapped in a vertical direction of the first wiring pattern layer 121.SELECTED DRAWING: Figure 8
More Like This:
| JPS62282484 | SUBSTRATE FOR MANUFACTURE OF ELECTRONIC CIRCUIT |
| JP2005191104 | MULTI-DIVIDED WIRING BOARD |
Inventors:
LIM JUN YOUNG
YOON HYUNG KYU
CHAE SUNG MIN
YOON HYUNG KYU
CHAE SUNG MIN
Application Number:
JP2023123001A
Publication Date:
October 03, 2023
Filing Date:
July 28, 2023
Export Citation:
Assignee:
LG INNOTEK CO LTD
International Classes:
H05K1/02; H05K1/09; H05K3/46
Attorney, Agent or Firm:
Makoto Ono
Kennori Kanayama
Kazuki Shigemori
Kenji Ando
Hidehiko Ichikawa
Yoshie Sakurada
Yosuke Kawasaki
Youichi Iino
Yusuke Ichikawa
Yoshikazu Iwase
Kennori Kanayama
Kazuki Shigemori
Kenji Ando
Hidehiko Ichikawa
Yoshie Sakurada
Yosuke Kawasaki
Youichi Iino
Yusuke Ichikawa
Yoshikazu Iwase