Title:
可撓性発光ダイオードモジュール及び発光ダイオード電球
Document Type and Number:
Japanese Patent JP6494963
Kind Code:
B2
Abstract:
LED assemblies and related LED light bulbs. An LED assembly has a flexible, transparent substrate, an LED chip on the first surface and electrically connected to two adjacent conductive sections, a first wavelength conversion layer, formed on the first surface to substantially cover the LED chip, and a second wavelength conversion layer formed on the second surface. The flexible, transparent substrate has first and second surfaces opposite to each other, and several conductive sections, which are separately formed on the first surface.
Inventors:
Honji, Ryu
Juch, Chung
Juch, Chung
Application Number:
JP2014183805A
Publication Date:
April 03, 2019
Filing Date:
September 10, 2014
Export Citation:
Assignee:
Epistar Corporation
International Classes:
H01L33/50; F21S2/00; F21S4/10; H01L33/62
Domestic Patent References:
| JP3075689U | ||||
| JP2010267482A | ||||
| JP2015038853A | ||||
| JP2012018865A | ||||
| JP2007165811A | ||||
| JP2013165228A | ||||
| JP2011228463A |
Foreign References:
| WO2012085736A1 | ||||
| WO2012090350A1 | ||||
| US20120175667 | ||||
| WO2012011279A1 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Shinsuke Onuki
Tadahiko Ito
Shinsuke Onuki