Title:
FLEXIBLE PRINTED WIRING BOARD, COVER LAY FILM AND ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP3718357
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve production efficiency when a cover lay of a flexible printed board is laminated and cut a cost by using adhesive which is excellent in liquid stability by one liquid and short in a setting time.
SOLUTION: The wiring board adhesive composition is formed by compounding 3 to 50 pts.wt. of novolak type epoxy resin and 3 to 50 pts.wt. of boraminated epoxy resin to 100 pts.wt. of alcohol soluble nylon resin which is solid at normal temperature. Adhesive composition is applied to one side of the wiring board cover lay film. A cover lay film is laminated by the adhesive composition on a copper foil circuit board formed on a film with flexibility.
Inventors:
Kunio Tawara
Shin Takahashi
Shota Nakagawa
Takashi Nakatani
Yasuhiro Hayashi
Masanori Tsuda
Middle Koki
Ueda Shingo
Shin Takahashi
Shota Nakagawa
Takashi Nakatani
Yasuhiro Hayashi
Masanori Tsuda
Middle Koki
Ueda Shingo
Application Number:
JP36390198A
Publication Date:
November 24, 2005
Filing Date:
December 22, 1998
Export Citation:
Assignee:
Toagosei Co., Ltd.
Tokai Rubber Industry Co., Ltd.
Sumitomo Electric Industries, Ltd.
Tokai Rubber Industry Co., Ltd.
Sumitomo Electric Industries, Ltd.
International Classes:
H05K3/28; C09J163/00; C09J177/02; H05K1/03; (IPC1-7): H05K1/03; C09J163/00; C09J177/02; H05K3/28
Domestic Patent References:
| JP59204674A | ||||
| JP4304282A | ||||
| JP40001874B1 |