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Title:
可撓性基板の伸縮制御システム及び伸縮制御方法
Document Type and Number:
Japanese Patent JP6685093
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an expansion/contraction control system for a flexible substrate which can form a fine pattern on a moving flexible substrate having flexibility, and to provide an expansion/contraction control method, an alignment method, and an electronic device manufacturing method.SOLUTION: In an expansion/contraction control method for a flexible substrate, a moire fringe is generated by superimposing a reference moire mark MMR, not causing a dimensional change due to the delivery of a film substrate 8 having flexibility, on a first moire mark MM1 continuously delivered synchronously with the delivery of the film substrate 8, the distortion of the first moire mark is obtained based on the generated moire fringe, and the expansion/contraction of the continuously delivered film substrate 8 is controlled based on the obtained distortion of the first moire mark.SELECTED DRAWING: Figure 2

Inventors:
Shinya Matsubara
Yasuyuki Kitahara
Masayuki Abe
Application Number:
JP2015145895A
Publication Date:
April 22, 2020
Filing Date:
July 23, 2015
Export Citation:
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Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
B41F33/06; B41F7/02; B41F33/00; G03F7/20; H01L21/027
Domestic Patent References:
JP2015513797A
JP2010267682A
JP2011191282A
Foreign References:
US20080024902
Attorney, Agent or Firm:
Tetsuya Mori
Hide Tanaka Tetsu