FLEXIBLE WIRING BOARD AND SEMICONDUCTOR DEVICE USING THE SAME

Title:

FLEXIBLE WIRING BOARD AND SEMICONDUCTOR DEVICE USING THE SAME

Document Type and Number:

Japanese Patent JP2006253569

Kind Code:

A

Abstract:

To provide a flexible wiring board wherein soldering connection can be applied to its wires in a way of preventing their adjacent wires from being short-circuited even when pitches of a wiring pattern are minute, thereby downsizing a semiconductor device.

The flexible wiring board 1 soldered to electric components or a wiring board is provided, wherein soldering connection terminals 21 of the flexible wiring board 1 are formed on one side of its insulation film 3; and conductor members 22 are provided on a side (a second side of the insulation film) opposite to the side of the insulation film 3 (a first side of the insulation film), on which the connection terminals 21 are provided along the connection terminals 21 in a way opposite to the connection terminals 21 such that the insulation film 3 is sandwiched between the conductor members 3 and the connection terminals 21.

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Inventors:

HAMAGUCHI TSUNEO
ARIGA HIROSHI
KONDO TERUHIRO
SUGIDACHI ATSUSHI

Application Number:

JP2005070959A

Publication Date:

September 21, 2006

Filing Date:

March 14, 2005

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP

International Classes:

H05K1/14; H05K1/02; H05K1/11

Attorney, Agent or Firm:

Shogo Takahashi
Tadahiko Inaba
Kanako Murakami
Nakatsuru Kazutaka

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