Title:
FLEXIBLE WIRING BOARD
Document Type and Number:
Japanese Patent JP3244616
Kind Code:
B2
Abstract:
PURPOSE: To enable an electrical wiring to be easily led from the surface of a cylinder to a plane not parallel with the axis of the cylinder by a method wherein a capacitor is formed between a wiring of a wiring board wound on the cylinder and the cylinder or between a wiring and a conductive foil.
CONSTITUTION: An electronic element 2 is arranged on the surface of a cylindrical bobbin 1 with a flange 5 at its lower edge, a single-sided flexible wiring board is used as a lead wire, and the base 10 of the flexible wiring board is pasted on the surface of the bobbin 1. A copper foil pattern 11 on the flexible wiring board is formed thick and connected to an RPC 12 disposed on the flange 5 to form a capacitor. By this setup, an electric wiring can be easily led out onto a plane not in parallel with axis of the cylindrical bobbin 1, so that a connection failure or a mis-wiring is prevented, and an externally added capacitor can be dispensed with.
Inventors:
Hikonari Ishikawa
Hideo Shino
Hideo Shino
Application Number:
JP8384895A
Publication Date:
January 07, 2002
Filing Date:
April 10, 1995
Export Citation:
Assignee:
JEOL Ltd.
International Classes:
H05K1/02; H05K1/00; H05K1/16; H05K1/18; (IPC1-7): H05K1/02
Domestic Patent References:
| JP6275935A | ||||
| JP58184782A |
Attorney, Agent or Firm:
Masanobu Ebikawa (7 others)
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