FLIP CHIP BONDING INSPECTION METHOD

Japanese Patent JP3599986

B2

PROBLEM TO BE SOLVED: To inspect even a micro open circuit at a bonded part reliably by determining the mean difference of measurement of heights between the rear surface of a semiconductor bare chip at all bump bonded parts and the circuit board surface in the vicinity thereof.
SOLUTION: X-rays from an X-ray generator 1 transmits a circuit board 2 and a flip-chip IC3 bonded thereon and converted on the sensor surface of an X-ray sensor into light to be imaged. Bonded part of the X-ray image is blackened as compared with peripheral part and the position thereof can be specified easily. The height corresponding to the upper part of the bonded part is measured on the rear surface of the IC3 by means of a laser focus displacement gauge 5 having accuracy of 1 μm or better. Furthermore, the surface height of the circuit board closest to the bonded part is measured and lines representative of the rear surface height of the IC and the surface height of the circuit board are determined from measurements of at all bonded points by the method of least squares. A decision is made that one side of the IC3 is floating it the difference of inclination between both lines exceeds a specified value.

Masaru Ichihara
Noriyuki Suzuki
Kazumasa Okumura

JP35100697A

December 08, 2004

December 19, 1997

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Matsushita Electric Industrial Co., Ltd

G01N23/04; G01B11/00; G01B15/00; G01B21/00; G01B21/02; G01N25/72; G01N29/00; H01L21/60; H05K3/00; (IPC1-7): G01B21/00; G01B11/00; G01B15/00; G01B21/02; G01N23/04; H01L21/60; H05K3/00

JP5119026A
JP8124985A
JP10253323A
JP7221151A
JP9166422A

Kenhide Okazaki
Toshio Nishizawa

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