FLIP-CHIP TYPE SEMICONDUCTOR DEVICE - MITSUBISHI ELECTRIC CORP

Title:

FLIP-CHIP TYPE SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JPS587884

Kind Code:

A

Abstract:

PURPOSE: To improve the reliability of a semiconductor device by reducing the adhering area of an electrode adhered to a conductor piece on an insulating member of a package.

CONSTITUTION: A semiconductor element dies 9 formed on one main surface side is formed with electrodes 6, 7 confronted with the surface of a package at the main surface side on a package 13 having an insulating member on the surface formed with a main body of metal. The electrodes are bonded to be electrically connected to conductor pieces 15a, 17a respectively formed on the metal or the insulating members 14, 16 on the surface of the package. The adhering areas of the electrodes 15a, 17a bonded to the pieces can be reduced.

More Like This:

JPS54130884	PRODUCTION OF JUNCTION-TYPE FIELD EFFECT TRANSISTOR
JPS5724569	UHF BAND GAAS FET
JPH04288870	SEMICONDUCTOR DEVICE AND INVERTER USING SAME

Inventors:

KOBIKI MICHIHIRO
WATASE MANABU
SUZUKI TAKESHI

Application Number:

JP10602081A

Publication Date:

January 17, 1983

Filing Date:

July 06, 1981

Export Citation:

Click for automatic bibliography generation Help

Assignee:

MITSUBISHI ELECTRIC CORP

International Classes:

H01L29/80; H01L21/338; H01L21/60; H01L29/812; (IPC1-7): H01L21/60; H01L21/92

Attorney, Agent or Firm:

Shinichi Kusano

Next Patent: GENERATION OF INSPECTION SERIES