PURPOSE: To prevent the peel-off between metal layers in ground layers beneath an electrode and to improve the life of the electrode, by forming a meniscus part at the lower edge part of the ground layer of the electrode in a flip chip having a protruding electrode.

CONSTITUTION: The surface of a planar element, in which inner electrode wiring 3 consisting of an Al electrode wiring is formed, is coated with a protecting film 4 consisting of an SiO2 film, a glass film and the like. An electrode window is provided in the protecting film 4. A Cr layer 6 is constituted by chemical dry etching so as to form a meniscus 11 at the inner skirt of an egdge part 10 of the window. Then sputtering or ion milling is performed when a Cu layer 7 and an Au layer 8 are formed. As a result, the side walls of the end parts of the etched Cu layer 7 and Au layer 8 are vertically etched with respect to the protecting film 4. Stress concentration is made less by the formation of the meniscus 11 in this way, and the peel-off of the Cr layers from the other layer 5 can be prevented.